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干货分享|有效避免陶瓷电容器断裂的安装方法
作者:红宝电容 来源:http://www.jnhongbao.com 日期:2020-08-05 09:40 浏览

  如何有效避免在陶瓷电容器焊接到电路板上的工序中发生弯曲引起电容器断裂的问题?为避免这种情况发生,将电容器安装在电路板弯曲部位的反方向上,会有比较好的效果。安装方法如下:

  How to effectively avoid the problem of capacitor fracture caused by bending in the process of capacitor welding to circuit board? In order to avoid this kind of situation, it will be better to install the capacitor in the opposite direction of the bending part of the circuit board. The installation method is as follows:

  1)电路板施压方向与零件安装方向

  Pressure direction of circuit board and installation direction of parts

  图1分别是针对电路板施压方向纵向和横向装配零件的例子。面对压力的方向,将零件进行横向安装,可减缓来自电路板的压力。

  Figure 1 is an example of assembling parts vertically and horizontally in the direction of applying pressure to a circuit board. Facing the direction of pressure, install the parts horizontally to reduce the pressure from the circuit board.

1.png

  图1 电路板施压方向与零件装配朝向

  通过抗电路板弯曲试验,将图1中①、②的评价结果如图2所示。可知通过装配在②方向上,电路板弯曲耐性增高,不易对零件施加压力。

  Through the bending resistance test, the evaluation results of ① and ② in Fig. 1 are shown in Fig. 2. It can be seen that through assembly in the direction of ②, the bending resistance of the circuit board is increased, and it is not easy to exert pressure on the parts.

  零件安装方向与残留率之间的关系

  Relationship between installation direction and residual rate of parts

2.png

  图2 零件安装方向与残留率之间的关系

  2)电路板裂口附近的电容器安装

  Capacitor installation near circuit board crack

  电路板裂口或电路板切口处,是生产工序中最容易导致电路板施压的环节。例如,电路板裂口附近如图3装配零件时,如果以B、D<C<A的顺序装配则容易受到压力。

  Circuit board crack or circuit board cut is the most easy to cause circuit board pressure in the production process. For example, when assembling parts near the crack of the circuit board as shown in Figure 3, if the parts are assembled in the order of B, d < C < A, they are easy to be stressed.

3.png

  图3 电路板裂口附近的零件安装实例

  那么,我们看一下有无缺口时电路板的变形程度。

  Well, let's look at the deformation of the circuit board with or without a notch.

  有无缺口时,电路板弯曲有何不同呢?FEM解析结果如图4、图5所示。

  What is the difference between the bending of the circuit board with and without a notch? The results of FEM analysis are shown in Fig. 4 and Fig. 5.

  设想在模型图中所示位置装配零件的情况。(电路板1.6mm厚的FR4)

  Imagine assembling parts in the position shown in the model drawing. (circuit board 1.6mm thick FR4)

  图4为没有缺口的情况。电路板的压力大,在电路板装配位置会产生红色~黄色拉伸应力,电容器存在发生开裂的危险。

  Figure 4 shows the case without gap. Due to the high pressure of the circuit board, the red to yellow tensile stress will be produced at the assembly position of the circuit board, and the capacitor may crack.

  另一方面,图5是有缺口的情况,可知装配零件的位置为绿色,电路板几乎没有产生弯曲。施加在零件上的压力能够控制在相当小的范围,所以是避免电容器开裂的有效方法。

  On the other hand, it can be seen that there are almost no bending parts in the circuit board 5. The pressure applied on the parts can be controlled in a relatively small range, so it is an effective method to avoid capacitor cracking.

图4 无缺口模型与弯曲分布_1.png

  图4 无缺口模型与弯曲分布

图5 有缺口模型与弯曲分布.png

  图5 有缺口模型与弯曲分布

       综上所述,通过电路板缺口缓解压力,为此与缺口边线平行配置零件朝向(图3中D)最有效。此外,无法改变零件朝向时,为使电路板不易发生变形,建议设置缺口为好(图3中B)。

  To sum up, it is most effective to relieve the pressure through the circuit board notch, so it is most effective to configure the part orientation (D in Fig. 3) parallel to the notch edge line. In addition, when the orientation of the parts cannot be changed, it is recommended to set the notch (B in Fig. 3) in order to prevent the circuit board from deformation.

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