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贴片电容特有的属性大大提供了设备的稳定性
作者:红宝电容 来源:http://www.jnhongbao.com 日期:2020-09-15 08:52 浏览

  电子元器件技术在不断的发展和进步,适应了更高要求的电子设备,贴片电容在电子设备中能够提高设备的稳定性,是电子设备正常稳定运行的辅助配件。

  With the continuous development and progress of electronic component technology, the chip capacitor can improve the stability of electronic equipment, and it is an auxiliary accessory for normal and stable operation of electronic equipment.

贴片电容

  贴片电容相对于普通的电子元器件来讲,优势已然相当的明显了。比如说我们平时用的手机可以做得更小,可以做得更轻薄,除了有设计方面的功劳之外,还有一个重要的原因,就是这些电子元器件全部都是采用的贴片的产品,这样就可以保证这里面的电路结构尺寸进一步的压缩,那自然就可以生产出轻薄的好看好用的手机,或者是其他的一些电子设备。

  Compared with common electronic components, SMC has obvious advantages. For example, the mobile phones we usually use can be made smaller and lighter. In addition to the credit for design, there is also an important reason that these electronic components are all chip products, which can ensure the further compression of the circuit structure size inside, so that we can naturally produce light, good-looking and easy-to-use mobile phones, or These are other electronic devices.

  贴片电容的无引线或者引线短、体积小、重量轻、厚度薄化,尤其是无引出线或者短引出线结构,使得它更能够经受得住震动和冲击、更容易将电路工作中产生的热量传递出去。

  The chip capacitor has no lead or short lead, small size, light weight and thin thickness, especially the structure without lead or short lead, which makes it more able to withstand vibration and impact, and more easily transfer the heat generated in the circuit work.

  再加上贴片电容在设计和制造时就已经考虑到了满足表面组装技术中高温焊接条件与清洗条件的要求,贴片电容的材料及其适当的封装方式本身就耐高温、不怕焊、耐潮湿。

  In addition, the chip capacitor has been designed and manufactured to meet the requirements of high-temperature welding conditions and cleaning conditions in surface assembly technology. The material of SMC and its appropriate packaging method are resistant to high temperature, welding and humidity.

  此外,贴片电容表面的组装技术并不像普通电容采用的插入式技术,而采用贴片式电子元器件的表面组装电路就从根本上消除了产生这一故障的根源,从而提高了电子设备的可靠性。

  In addition, the surface assembly technology of SMC is not like the plug-in technology used by ordinary capacitors, but the surface assembly circuit using SMD electronic components can fundamentally eliminate the root cause of this fault, thus improving the reliability of electronic equipment.